Operator: Greetings, and welcome to the Veeco First Quarter 2026 Earnings Call. [Operator Instructions] It is now my pleasure to introduce your host, Alex Delacroix, Head of Investor Relations. Thank you. You may begin.
Alex Delacroix: Thank you, and good afternoon, everyone. Joining me on the call today are Bill Miller, Veeco's Chief Executive Officer; and John Kiernan, our Chief Financial Officer. The earnings release and slide presentation to accompany today's webcast is available on the Veeco website. To the extent that this call discusses expectations for future revenues, future earnings, the timing and expected benefits of the proposed transaction with Axcelis, market conditions or otherwise make statements about the future, these forward-looking statements are based on management's current expectations and are subject to the risks and uncertainties that could cause actual results to differ materially from the statements made. These risks are discussed in detail in our Form 10-K, annual report and other SEC filings. Veeco does not undertake any obligation to update any forward-looking statements, including those made on this call, to reflect future events or circumstances after the date of such statements. Unless otherwise noted, management will address non-GAAP financial results. We encourage you to refer to our reconciliation between GAAP and non-GAAP results, which you can find in our press release and at the end of the earnings presentation. Please note that we will not be addressing questions related to our pending merger with Axcelis. We urge you to read the joint proxy statement relating to the transaction with Axcelis. With that, I would now like to hand the call over to our CEO, Bill Miller.
William Miller: Thank you, Alex, and thank you, everyone, for joining us today. Veeco executed well in the first quarter and believe we're strategically positioned to benefit from the evolving semiconductor landscape, driven by artificial intelligence and high-performance computing. Reviewing our first quarter results, revenue was $158 million, non-GAAP operating income was $9 million, and non-GAAP diluted earnings per share was $0.14, all within our guidance ranges. Now let me take a moment to highlight our top 5 key takeaways for the quarter. First, we're poised to benefit from the significant industry inflection driven by the global build-out of AI infrastructure. Veeco is well positioned across our portfolio with highly differentiated process equipment aligned with high-growth opportunities. Second, order activity that accelerated in the second half of 2025 continued into the first quarter of 2026, and our pipeline of new opportunities continues to expand. Third, as it pertains to the compound semiconductor market, a stronger-than-expected opportunity has emerged for Veeco to capture multiyear revenue in the production of indium phosphide lasers. This is a result of the broader transition from copper to optics within data centers over the next few years for increased speed and bandwidth to meet the scale-up needs of the AI landscape. This opportunity for Veeco spans across multiple products, particularly for epitaxy and laser facet coatings, which I will provide more details on later in the call. Fourth, from an operational standpoint, we're expanding our manufacturing footprint and capacity to support increasing customer demand and enable timely deliveries. Lastly, as a result of accelerated bookings activity and ongoing customer engagements, we've increased visibility with significant orders for delivery well into 2027. Overall, we believe Veeco is well positioned for durable multiyear growth driven by AI infrastructure and high-performance computing, and we remain focused on disciplined execution to deliver long-term value. Before I move to the next slide, as a brief reminder, we continue to make progress on our proposed merger with Axcelis. The transaction has been approved by shareholders of both companies, and all regulatory approvals have been received other than antitrust approval in China. We remain engaged with the authorities in China and continue to expect the transaction to close in the second half of 2026. Integration planning is progressing well, and we remain excited about the strategic fit and long-term potential for value creation. Moving to the next slide, I'll discuss Veeco's critical role in the semiconductor manufacturing landscape, which represents the majority of our revenue. Capital spending is being driven by AI investments and is becoming increasingly concentrated at the leading-edge areas where Veeco is differentiated in technology. In logic and foundry, Veeco has a long-standing and trusted position supporting advanced annealing applications across leading nodes. Our LSA platform continues to be production tool of record at all 3 Tier 1 logic customers, driving repeat business and strong customer engagement, pushing towards more complex device structures with low cost of ownership. At the same time, our next-generation nanosecond annealing platform is progressing through evaluations at Tier 1 logic customers, addressing critical low thermal budget applications such as contact annealing, materials modification and 3D device integration. These evaluations are advancing well, and we're anticipating an additional evaluation tool shipment to a third Tier 1 logic customer in the coming months. Expanding our penetration within our memory customers within the semiconductor market remains one of our most important strategic priorities. The transition toward AI-centric architectures, high-bandwidth memory and increasingly complex stack devices is driving new thermal and materials requirements, where we believe Veeco's technologies provide a clear advantage. During the first quarter, we continue to make solid progress with our top Tier 1 memory customers. In addition to serving as the production tool of record at a leading HBM supplier, we're advancing our LSA evaluation system at a second Tier 1 DRAM manufacturer with the potential for initial pilot line and high-volume manufacturing orders in 2027. We're also extending our memory opportunity through Ion Beam Deposition. Multiple IBD300 systems remain under evaluation at leading DRAM customers with activity extending throughout 2026. The systems enable low-resistance film deposition for advanced DRAM bit line metallization, providing an additional pathway to expand our served available market. Veeco remains a market leader in Ion Beam Deposition for EUV mask blanks, a critical enabling technology as logic and memory customers expand EUV adoption and prepare for high-NA lithography. We also have broadened our exposure to EUV pellicles, which are increasingly required to protect these critical masks as EUV usage scales. Advanced Packaging, supported by our wet processing and lithography tools continues to be a significant revenue driver from AI-related demand. As we discussed last year, our Advanced Packaging business more than doubled year-over-year, reflecting strong customer adoption and accelerating capacity investments. During the first quarter, we secured major volume orders for our wet processing systems from leading OSAT customers, supporting high-volume manufacturing of next-generation AI accelerators built on 2.5D Advanced Packaging architectures. These systems are scheduled to ship throughout the remainder of 2026 and into the first half of 2027, providing strong revenue visibility. To support this growth, we're continuing to expand our manufacturing footprint and production capacity, positioning the business to meet sustained customer demand as Advanced Packaging plays an increasingly critical role in AI infrastructure. As we turn to the next slide, we outline our forecast served available market within our semiconductor segment through 2030. This outlook continues to be driven by sustained investment in AI and high-performance computing. In annealing, we project the SAM to be $1.3 billion by 2030 as devices continue to shrink and shallower and more precise anneals are required to improve performance. These trends support long-term opportunities for both LSA and next-generation NSA platforms. Next, in Ion Beam Deposition, our IBD300 platform for low-resistance metals, together with our leadership position in IBD EUV mask blanks as well as the emerging opportunity in pellicles where we're production tool of record at a leading customer, all represent meaningful market opportunity and total a SAM projection of $500 million by 2030. As devices become more power constrained and EUV adoption broadens, the opportunities for our technologies continue to increase. Finally, in the back-end semiconductor process, our Advanced Packaging business for our wet processing and lithography tools continues to expand rapidly, and the SAM is projected to reach $1 billion by 2030. We continue to demonstrate our ability to support our customers' high-volume manufacturing ramps driven primarily by AI. Moving to the next slide. I want to spend time discussing our stronger-than-expected momentum in the compound semiconductor market. We're seeing a clear industry inflection point underscored by NVIDIA's recent investments in optical networking leaders. In silicon photonics, the industry is transitioning from copper interconnects to co-packaged optics as AI data centers require higher speeds, greater bandwidth density and improved power efficiency. Indium phosphide laser manufacturing is a critical component of this shift and a foundational technology for next-generation AI optical infrastructure. As the industry transitions towards future capacity requirements, we believe this represents a growth opportunity of approximately $2 billion over the next several years. Veeco plays a critical role across multiple steps of the indium phosphide laser manufacturing process, and we're seeing rapidly accelerating order demand across several of our product lines. Beginning with epitaxy, MOCVD is a critical step, and we're seeing increasing orders for our Lumina MOCVD indium phosphide platform as leading photonics customers expand capacity to support AI-driven data center growth. We also support downstream process steps with our WaferEtch and WaferStorm wet processing technologies for advanced etching and surface preparation. What I would like to highlight for investors is the laser facet coating and epitaxy opportunities are similar sized and significant for the manufacturing of indium phosphide lasers. Our SPECTOR Ion Beam Deposition system designed for the critical laser facet coating step is essential to the process. Veeco is a market leader in Ion Beam Deposition and is differentiated from traditional approaches such as e-beam evaporation, ion-assisted deposition or PVD. Compared to other approaches, the SPECTOR Ion Beam Deposition tool delivers low loss optical films with tight control of thickness, uniformity and reflectivity. Precision is required for anti-reflective and highly reflective facet coatings on indium phosphide lasers. We have engagements with industry leaders that will drive the growth of our SPECTOR IBD business in 2027 and beyond. As announced in today's press release, we received over $250 million in orders from multiple customers for our MOCVD, wet processing and Ion Beam Deposition tools to support the manufacturing of indium phosphide lasers with delivery starting in 2026 and significantly accelerating in 2027. A large portion of these orders is for our SPECTOR IBD system from leading suppliers of next-generation 800-gig and 1.6 terabyte optical transceivers for hyperscale customers. This significant order activity underscores the long-term value of our Ion Beam Deposition technology leadership and our expanding role in this rapidly growing market. We have long-standing partnerships with our customers spanning more than 2 decades, and we are well positioned across our multiple differentiated products to meet their growing needs in silicon photonics. Our focus remains on supporting customer production ramps, executing early deployments and expanding our footprint to meet customer demand. With that, I'll flip to the next slide to share our projected served available market within the compound semi space. In silicon photonics, specific to the manufacturing of indium phosphide lasers, we project our SAM to be $700 million in 2030. As we discussed on the previous slide, demand is accelerating across several of our products driven by AI data centers. Our Lumina MOCVD batch platform, WaferStorm and Etch and our SPECTOR Ion Beam Deposition for the laser facet coatings are gaining significant traction. Other photonics driving SAM growth include red MicroLEDs, solar cells for low earth orbit satellites and AR/VR applications. Additionally, a global optoelectronics solution provider accepted and qualified our Lumina plus MOCVD system for high-volume arsenide phosphide production, including for use in MicroLEDs. We expect these other photonics application SAM to total $550 million by 2030. In GaN Power, we project our SAM to be $250 million by 2030 as we continue to see strong long-term drivers tied to AI data center power efficiency, electrification and high-power density applications. Importantly, at a leading power IDM customer, we have an evaluation for our Propel 300 system in place, and we received a pilot line order for a multi-chamber system, which we previously announced at the end of 2025. This represents an important validation point as customers move from development to early production. Looking ahead, as this customer ramps and finalizes long-term capacity plans, there is potential for additional system orders in the second half of 2026 for delivery in 2027. In the next several years, we expect our compound semiconductor served available market opportunity to meaningfully grow as AI, power efficiency and advanced connectivity continue to reshape the industry. I would now like to hand the call over to John to walk through the financials.
John Kiernan: Thank you, Bill. Revenue came in at $158 million, slightly below the midpoint of our guidance and previous quarter. Our semiconductor business reported $109 million, a decline of 1% and comprising 69% of revenue. Revenue in the semiconductor market was largely driven by laser annealing systems for leading foundry, logic and memory customers and wet processing systems for Advanced Packaging. Compound semiconductor revenue totaled $19 million, a 6% decline from the prior quarter, totaling 12% of revenue. Data storage revenue was $10 million, flat to the prior quarter, representing 6% of revenue. Scientific and other revenue declined 16% to $20 million, comprising 13% of revenue. Turning to the quarterly revenue by region. Revenue from Asia-Pacific region, excluding China, was 57%, no change from the prior quarter. Sales were driven by leading semiconductor customers in Taiwan for our laser annealing systems and wet processing systems for advanced packaging. The U.S. accounted for 20% of revenue, an increase from the previous quarter, primarily from semiconductor customers. Our China portion was 13% of revenue, a decrease from the previous quarter. EMEA and the rest of the world accounted for 10% of revenue. Turning to the first quarter non-GAAP results. First quarter gross margin came in at 36% and operating expenses totaled $49 million. Income tax expense was approximately $1 million, resulting in an effective tax rate of approximately 11%. Net income was approximately $9 million and diluted EPS was $0.14 on 62 million shares. Moving to the balance sheet and cash flow highlights. We ended the quarter with cash and short-term investments of $383 million, a decline of $7 million. From a working capital perspective, our accounts receivable increased by $40 million to $151 million. Inventory increased by $7 million to $282 million and accounts payable increased by $5 million to $60 million. Customer deposits included within contract liabilities on the balance sheet increased $19 million to $69 million. Cash flow from operations totaled $8 million and CapEx totaled $5 million during the quarter. Next, I'll turn to our second quarter non-GAAP outlook. Second quarter revenue is expected to be between $170 million and $190 million. Gross margin is expected to be between 38% and 40%. We expect OpEx between $52 million and $55 million, net income between $12 million and $21 million and diluted EPS between $0.20 and $0.32 on 64 million shares. Based on our current visibility, we're reiterating our full year 2026 revenue guidance between $740 million and $800 million, with growth accelerating in the second half of the year as well as reiterating our diluted non-GAAP EPS between $1.50 and $1.85. I'll now provide additional commentary for each of our markets. Beginning with the semiconductor market, in 2026, we expect strong growth from our Tier 1 customers driven by AI and high-performance computing, more than offsetting declines in the mature node China business. Additionally, our advanced packaging wet processing systems are forecasted to contribute to revenue growth as customers increase manufacturing capacity to support AI workloads. In the compound semiconductor market, we see strong growth in silicon photonics, particularly for indium phosphide laser manufacturing driven by AI data center demand. We are also seeing emerging opportunities for low earth orbit satellites, MicroLEDs, AR/VR applications and GaN Power. We have received significant orders in the first quarter across this market, which is driving meaningful revenue growth into 2027. In data storage, we secured orders in the second half of 2025 and experienced continued order activity in 2026 for our Ion Beam equipment. We are seeing increase in AI-driven demand for higher capacity HDDs, supporting investments in capacity and new technologies such as HAMR. Customer engagements remain strong with our business fully booked in 2026 and extending into the first half of 2027. As we look ahead, we are seeing continued acceleration across several of our core markets, supported by increased customer engagement, expanding pipelines and strong order visibility. Our focus remains on disciplined execution as we support customer production ramps and deliver against the next phase of growth. I would now like to turn the call to the operator for Q&A.
Operator: [Operator Instructions] As a reminder given the pending merger with Axcelis, the Veeco management will not be addressing questions related to the transaction. [Operator Instructions] Our first question comes from Denis Pyatchanin with Needham & Company.
Denis Pyatchanin: So maybe we can start with this $250 million order with the orders beginning in 2026. Could you tell us maybe which quarter would you expect this to start Q3 or Q4? And then at what point in 2027 do you think this will kind of hit its revenue quarterly peak?
William Miller: Denis, I would say we'll start shipping against those $250 million plus of aggregate orders in the third quarter. But I would say probably the most significant ramp will probably start in Q1 '27.
Denis Pyatchanin: Great. And then for these systems for the Lumina, for the SPECTOR and for the WaferEtch, kind of what are your current lead times? And what do you think your maximum capacity is to meet demand for these systems on an annual basis?
William Miller: We have plans to increase our SPECTOR IBD capacity about 10x from its kind of base level we're at today and starting to hit that kind of level in early '27. And we're looking at future capacity needs to potentially double that again. And in wet processing, we're looking to add some expansion capacity to our existing facility as well as looking to an outsourced partner contract manufacturer in Southeast Asia for further capacity expansion.
Denis Pyatchanin: Great. And then my final one is about gross margins. So it looks like we came down a little bit to 36.2% from 37.7%. Is this predominantly due to mix like heavier advanced packaging? Or maybe were there some other variables contributing?
John Kiernan: Yes. I think specifically to Q1, one of the factors that contributing is that we had one less system, LSA system to a China customer. We got recently informed by BIS that, that customer would require a license to ship to certain fabs for that customer. So that had about an $8 million impact on the top line for Q1 and also put us outside, as you mentioned, the gross margin guidance range.
Operator: Our next question comes from David Duley with Steelhead Securities.
David Duley: A few other questions on the significant order activity. I was wondering, you kind of addressed it, but it sounds like there are like 3 tools involved in the big order here. And are they equally split? Or could you just kind of talk about the volume of each tool in the $250 million order? And then as far as the ramp-up of this business, is this -- did you take this business from another competitor? And so I'm kind of curious about the competitive dynamics of this. And are you sole sourced? Or are you sharing the business?
William Miller: Yes, Dave, let me give you some color here because we don't really talk -- haven't really historically talked a lot about the indium phosphide solutions that we have. So if you think about -- there's really 3 pieces that Veeco serves in indium phosphide laser manufacturing. First is the epi step, which I think is pretty well known and discussed. So Veeco and our competitor provide MOCVD equipment to make the business end of the laser, the indium phosphide epitaxy that makes the device. We also have wet processing, wet etch and wet clean steps as part of the formation of the laser. And then also a part that's probably not as well known by investors is Veeco has an Ion Beam Deposition product called the SPECTOR that deposits the antireflective and highly reflective coatings to create the laser facet coatings in the laser. And as you might guess, having followed the company, Ion Beam Deposition can deposit films much better than PVD or e-beam deposition, et cetera. And so we can deposit films with much better optical properties, very similar to the fact that we can make better IBD EUV films or better Ion Beam Deposition films for low-resistance metals. So here's another example of kind of ion beam core technology where Veeco sold over 100 tools during the dot-com boom lighting up DWDM fiber and then that business kind of went away for quite a long time. But during that time, Veeco maintained the deep technical relationships with a number of key customers where we are kind of process tool of record in their laser facet coating business. And so I think it's probably worth noting that when you look at the size of the 3 opportunities in front of us, the epitaxy market and the laser facet coating market opportunities are about the same size. They're pretty significant markets. And I would characterize our laser facet coating opportunity where we have a very strong incumbent position, not everywhere, but in a number of key companies. Whereas in the epitaxy space, as I think you know, our competitor has a decent, very good incumbent position, but Veeco has, over the past number of years, developed some products to improve our competitiveness. And in that group of $250 million plus of orders, a number -- we did receive a number of MOCVD orders in -- as part of that ramp. So I would say a large portion of that was for the IBD laser facet opportunity, but also includes some very important orders for wet processing because that's a really critical step in the device manufacturing as well as the epitaxy step.
David Duley: Okay. So the epi step is the one where you've gone head-to-head, I think, with like AIXTRON and...
William Miller: Correct.
David Duley: I guess one part of the business here. Would you say you're a second source or a primary source? And I'm sorry to dwell on this, but it mentioned in the press release, I think, multiple customers. Could you just elaborate a little bit more about your positioning?
William Miller: Yes. So I would say in laser facet coating, we have a very strong incumbent position. I would say in the epitaxy step, we are probably more the second provider there today as a second source. And I would say in the wet processing, we have a strong position there with a number of the leaders there.
David Duley: Okay. Final question for me, and we'll turn it over to others is, the GaN opportunity, I think you talked about it and you've received an order in the past, I think, from a 300-millimeter GaN customer. How big of a market do you think that, that could be if you're able to penetrate and capture some of the business that I'm assuming all these things are -- all these GaN parts are going into the data center, but maybe I'm wrong, maybe you could just elaborate a little bit about that. And that's it for me.
William Miller: Yes, Dave, you're right on there. I mean I'd say the adoption of 300-millimeter GaN on silicon is squarely targeted at the AI data centers. I would say we've had, as you know, a tool out with a major IDM for some time. The performance of our tool set is doing quite well. We have a pilot line tool order from the customer, and we're in the process of manufacturing that and would expect to ship that at the end of the year kind of time frame. So yes, it's definitely squarely in the AI data center applications.
Operator: Our next question comes from Gus Richard with Northland Capital Markets.
Auguste Richard: Congratulations on the huge order momentum. To hit the high end of the range for the full year, what are the levers to get there? Is it delivery times?
John Kiernan: Yes. So thanks for the question, Gus. I think our opportunity to go to the higher end of the range right now, primarily rest in the semiconductor piece of our business. And I would say in the areas of laser annealing and lithography are probably sort of the drivers there. If I look at the other markets and I look at, like, for example, the data storage market, given our lead times and how we work with our customers on sort of build-to-order, there could be some upside in some service and aftermarket business, but the systems business is pretty much booked out for this year, and we're booking orders into next year. And in the compound semiconductor market, we're able to get some of this new business into the back half of the year, as Bill mentioned here in answering an earlier question about some tools coming into Q3 and Q4. And we were anticipating that as part of our view for the year already anyway. But the predominant increase in capacity and bringing on and meeting the customers' ship dates principally happen in 2027.
Auguste Richard: Got it. And sort of the underneath question is the SPECTOR. Does that have a similar 3-quarter lead time as ion beam for HDD?
John Kiernan: We'll work to -- on that sort of lead time. We've been in this business for a long period of time. Recent business is a few tools a quarter. And yes, I think the lead times are more in that sort of 9-month lead time there. As we look to ramp up this business here, we'll look to reduce lead and cycle times for that business in order to meet customer shipment requirements. But mainly, we're going to see sort of a step-up in the output for that business starting in Q1 of 2027.
Auguste Richard: Okay. Got it. Got it. Makes complete sense. And then just in terms of some of the evals that are going on, the Ion Beam bit for the memory market. Do you think you can reach conclusion on those evals in the next quarter or 2? And sort of what are your prospects on getting over the finish line?
William Miller: Yes. We're -- the feedback from our customers is it's not a matter of if, it's a matter of when. They're impressed with the -- very impressed with the film performance of the IBD, where we're working very closely with them is in areas such as particle performance, automation, reliability. And so they've extended their evals out through the end of 2026, and we're working on a few CIP improvements to the tool to address some of those shortcomings. So I would say it's really -- the customer is really quite excited about the opportunity, but we do have some, I would call it, engineering work left to do to demonstrate the high-volume requirements of front-end semi.
Operator: [Operator Instructions] Our next question comes from David Duley with Steelhead Securities.
David Duley: Could you talk a little bit more about the hard disk drive business? And what -- do you think that, that will -- what sort of second half growth profile should we expect versus the first half? And then you've talked about obviously having the order book is full and manufacturing costs are full for '26. Are you expanding capacity for 2027 at this point? Or it would seem to me like the disk drive guys are going to add a lot of capacity given what they're seeing from the AI data centers, but maybe I'm wrong.
William Miller: Yes. I would say, Dave, we're looking to double that business in '26 over '25. And I would say the trajectory of it is more second half loaded. I think probably the first system shipment is planned to happen in Q2, none in Q1 and then ramping in Q3 and Q4 just based on lead times. As you know, we kind of do a build-to-order model. We're not a build to forecast model. And that kind of keeps us and the industry healthy, and that does seem to work for everybody. But what we are seeing, I would characterize year-to-date at this point that both of our major customers are continuing to place orders, not only for front-end equipment at the wafer level, but also the back end, what they call the slider fabs, which clearly means that they're increasing the number of heads that they're producing. So I would guess based on the order activity we're seeing here early in '26 that certainly the first half of 2027 will remain strong. And I would just characterize the commercial activity still remains pretty positive from an order book standpoint. John, I don't know if you'd like to add.
John Kiernan: Yes. I think you covered that very well, Bill. I think that really sums up well where we are with 2026 and what visibility we have into 2027 at this time.
David Duley: And then final one for me is, what would you expect kind of a rough cut of what you expect your semi revenue to grow in '26? And I'm guessing it's probably going to grow higher in '27, but maybe you could elaborate a little bit on some of the puts and takes in growth in both '26 and '27.
John Kiernan: Yes. We see mostly sort of positive environment here in 2026 and estimates of a growing WFE environment in '26 and moving into 2027. So pieces of the business attached to AI and high-performance computing expected to grow. And so that's advanced foundry logic with our laser annealing product, high-bandwidth memory for our customer that we've penetrated there and continued strength in Advanced Packaging. I would say the one headwind for us in the semi business, but is more than offsetting the strength in the pieces of the business I just mentioned is declining business in China for mature node. So we expect that business to have headwind in 2026. We've been foreshadowing this for the last 2 years or so right now that we saw the business falling off in 2025. As a reminder, we have a narrow base of business there in China. It's really highly predominant for our LSA product for 40- and 28-nanometer fabs, and they just don't see that same level of investment in new fabs that we saw a couple of a couple of years ago. So taking all that into consideration, we see sort of our semi business growing this year over last year mid-teens.
David Duley: I was going to say, since you're taking your Chinese lumps this year, I would guess that your growth rate would probably accelerate next year.
John Kiernan: We're looking at a very positive WFE environment, and we have nice attachments to the areas that are expected to drive WFE. So yes, I think as we have this early look at 2027, 2027 looks positive. Bill did sort of mention earlier in the prepared remarks that we are increasing our capacity for Advanced Packaging. We see opportunities for that to continue to grow into 2027. So we're taking -- making some investments to increase capacity there as well.
William Miller: It's probably also worth mentioning, Dave, that a lot of the WFE estimates that you see include a big -- some pieces of the silicon photonics market. And so you'll see that show up in our compound semi. So when you look at semi alone, really some of the compound semi will probably be categorized as WFE by -- more generally. And so our compound semi business is probably going to grow 50%. So when you take the kind of the mid-teens that John spoke about and the portion that's really significantly growing, we're probably growing much higher than that on a WFE basis.
Operator: At this time, we have no further questions. I would now like to turn the call over to Bill Miller for closing remarks.
William Miller: Thank you. As we look ahead, we believe Veeco is well positioned to meet the evolving needs of our customers as the silicon photonics industry reaches an inflection point driven by AI and high-performance computing. Our technologies across logic, memory, Advanced Packaging, compound semi and data storage are becoming increasingly critical as customers push for greater performance, scale and efficiency. With strong customer demand, expanding served available markets and disciplined execution, we see meaningful long-term growth and remain focused on delivering sustained value for our shareholders. I'd like to thank our employees for their hard work as well as our customers, partners and shareholders for their continued trust in Veeco. Have a great evening.
Operator: Ladies and gentlemen, the conference call of Veeco has now concluded. Thank you for your participation. You may now disconnect your lines.